MTFDKCC7T6TFR-1BC15FC

Orderable parts

MTFDKCC7T6TFR-1BC15FCYY

Specs

  • Capacity
  • Chipset Validation
    N/A
  • FBGA Code
    N/A
  • Part Status
    Sampling
  • Product Line
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • READ

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-FD-48: 5300 SSD SMART Implementation

SMART Command Feature Set for the 5300
  • File Type: PDF
  • Updated: 2020-09-17

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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