MTFDHBE3T2TDG-1AW1ZAB

Orderable parts

MTFDHBE3T2TDG-1AW1ZABYY

Specs

  • Capacity
    3.2TB
  • Chipset Validation
    N/A
  • FBGA Code
    N/A
  • Part Status
    Production
  • Product Line
    7300 MAX
  • Product Longevity Program
    No
  • Product Longevity Program Start Date
    N/A
  • READ
    3,000 MB/s
  • WRITE
    1800 MB/s

REACH Statement

REACH Statement

Company statement regarding REACH SVHC compliance
  • File Type: (PDF)
  • Updated: 2/1/2023

Technical Notes

TN-00-08: Thermal Applications

This tech note describes considerations in thermal applications for Micron memory devices, including thermal impedance, thermal resistance, junction temperature, operating temperature, memory reliability, reliability modeling, device reliability, and high-temperature electronics.
  • File Type: PDF
  • Updated: 2022-08-09

TN-FD-15: P320h/P420m SSD Performance Optimization and Testing

This technical note describes how to optimize and test the performance of the Micron P320h and P420m SSDs.
  • File Type: PDF
  • Updated: 2014-04-07

Customer Service Notes

CSN-16: Micron Component and Module Packaging

Explanation of Micron packaging labels and procedures.
  • File Type: PDF
  • Updated: 2021-12-06

CSN-24: ESD Precautions for Die/Wafer Handling and Assembly

Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
  • File Type: PDF
  • Updated: 2010-08-05
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